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|MaxLinear Launches Industry's First 400Gbps PAM4 DSP SoC with Integrated Laser Drivers for Cloud Data Center and Enterprise Network Infrastructure|
The MxL935XX Telluride family of devices is the world’s first DSP SoCs with integrated electro-absorption modulated laser (EA-EML) drivers for 400Gbps optical interconnects. The MxL935XX device is the key component for system vendors to be able to develop a 400Gbps optical interconnect module in a compact form factor for intra-datacenter applications with a transmission distance up to 2 Kilometers.
The MxL935XX 16nm CMOS PAM4 DSP SoC consumes an extremely low power of 6.7W, which includes the integrated EA-EML driver power dissipation. The minimal power consumption of the MxL935XX meets the stringent power constraints of 400Gbps optical module form-factors, namely QSFP-DD, OSFP and COBO devices.
MaxLinear’s Telluride family of SoCs are key components in the
development of high speed mega-scale data centers based on 400Gbps
The MxL935XX is a family of highly versatile PAM4 DSP SoCs capable of one, two or four lanes of 100Gbps optical connectivity combined with a flexible 25G NRZ and 50G PAM4 electrical interface supporting multiple generations of switch ASICs. The multi-lane capabilities allow the MxL935XX devices to be used in a wide-range of optical interconnects supporting 100Gbps, 200Gbps, and 400Gps optical fiber data speeds in cloud mega-scale and enterprise data centers.
The integrated laser drivers in the MxL935XX family directly interface with the external optical lasers and eliminate the need for expensive external high-frequency components required for laser driver and modulator bias. The superior integration of system-level functionality in MxL935XX devices enable significant cost reductions even in today’s ongoing 100Gbps deployments.
"The exploding data traffic, and the demand for high-speed data have
placed an enormous burden on the cloud and enterprise data network
infrastructure. This is, in turn, not only compressing the network
upgrade cycle, but is also accelerating the need to deploy 400Gbps
optical networks inside mega-scale cloud and enterprise data centers,"
"Our Telluride MxL935XX 16nm CMOS SoC family, with integrated EA-EML
laser drivers, reduced external components, and superior link-margin
performance, is perfectly positioned to enable this leapfrogging
industry transition. We believe that, currently, the total addressable
market for 100Gbps and 400Gbps optical interconnect modules greatly
exceeds 10 million units annually, not including the anticipated future
rapid growth driven by the exploding internet traffic," concluded Dr.
Kishore Seendripu, CEO of
The first SoCs to be available from the Telluride family are the MxL93542 and MxL93543, which feature several operating modes that can connect to multiple generation of switch ASICs (128x25G NRZ, 256x25G NRZ or 256x50G PAM4) enabling 3.2Tbps, 6.4Tbps or 12.8Tbps front panel capacity per data center rack unit. These different operating modes span a variety of optical module form factors such as QSFP28, SFP-DD, QSFP-DD, OSFP and COBO.
For modes where the MxL93542 and MxL93543 interface with a legacy 25G NRZ switch ASIC, the corresponding forward error correction (FEC) functionality required for PAM4 optics is integrated into the device. Two separate instantiations of the FEC engine are available on-chip to support two distinct lanes of 100Gbps optics.
The integrated laser driver in the MXL93542 delivers greater than 1.8V of single-ended driver output swing necessary for EA-EML lasers. This output swing easily meets the optical modulation amplitude (OMA) specification requirements across the wide operating temperature and bias ranges of all EA-EML lasers. The chip package also includes all the high frequency components required for driver & modulator biasing.
The second version of the SoC, the MxL93543, which delivers 800mV of peak-to-peak differential driver output swing, can be easily paired with an external laser driver implemented in alternate optical technologies such as silicon photonics.
The devices feature a comprehensive digital pre-distortion (DPD) engine in the transmit direction to compensate for laser non-linearity, and to cancel packaging limitations that cause reflections and bandwidth degradation at these extremely high signal frequencies. On the receive path, the DSP includes an auto-adaptive signal enhancement engine, which integrates a continuous time linear equalizer (CTLE), automatic gain control (AGC), a feed forward equalizer (FFE), and a decision feedback equalizer (DFE).
The MxL93542 and MxL93543 are sampling now to leading optical module manufacturers. More information is available by emailing email@example.com.
MxL and the
Cautionary Note About Forward-Looking Statements
This press release contains forward-looking statements within the
meaning of Section 27A of the Securities Act of 1933, as amended, and
Section 21E of the Securities Exchange Act of 1934, as amended.
Forward-looking statements include, among others, statements concerning
our MxL935XX Telluride devices, the anticipated launch into mass
production of 400 Gbps solutions in the latter half of 2018, and the
size of the market for 100Gbps and 400Gbps optical interconnect modules
as well as statements concerning or implying the performance of
MaxLinear’s technologies, their potential use cases, and the potential
impact of these technologies on our business and future operating
results. These forward-looking statements involve known and unknown
risks, uncertainties, and other factors that may cause actual results to
be materially different from any future results expressed or implied by
the forward-looking statements. Forward-looking statements are based on
management’s current, preliminary expectations. In particular, our
assumptions concerning the launch of 400Gbps solutions by optical module
vendors and the overall market size and opportunity reflected by 100Gbps
and 400Gbps modules could prove incorrect. Additional risks and
uncertainties arising from our operations generally and our recently
completed acquisitions include intense competition in our industry; our
dependence on a limited number of customers for a substantial portion of
our revenues; uncertainties concerning how end user markets for our
products will develop; potential uncertainties arising from continued
consolidation among cable television and satellite operators in our
target markets and continued consolidation among competitors within the
semiconductor industry generally; our ability to develop and introduce
new and enhanced products on a timely basis and achieve market
acceptance of those products, particularly as we seek to expand outside
of our historic markets; potential decreases in average selling prices
for our products; and risks relating to intellectual property protection
and the prevalence of intellectual property litigation in our industry..
In addition to these risks and uncertainties, investors should review
the risks and uncertainties contained in our filings with the
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